DA9275.007
19 February 2004
PACKAGE (MSOP-8) OUTLINE
Gage plane
R
Land
Pattern
A
A
Q
P
F
E1
E
Recommendation
L
R1
N
e
c
c1
D
G
M
b1
(b)
A2
A
A1
Section A - A
b
Symbol
Min
Nom
Max
Unit
A
A1
A2
b
1.10
0.15
0.95
0.38
0.33
0.23
0.18
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
0
0.75
0.22
0.22
0.08
0.08
0.85
0.30
b1
c
c1
D
3.00 BSC
4.90 BSC
3.00 BSC
0.65 BSC
4.8
E
E1
e
F
G
L
0.65
0.40
0°
0.60
0.80
8°
(Terminal length for
soldering)
M
N
0.41
1.02
mm
mm
P
Q
0.25 BSC
mm
mm
mm
R
0.07
0.07
R1
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
All measurement according to JEDEC standard MO-187.
7 (10)
MAS [ MICRO ANALOG SYSTEMS ]
