DA9178.001
10 Dec, 2003
PAD LAYOUT
1906 µm
VSS RFM RFP PDN AON DEC
9178
A1
1778 µm
VDD QOP QI QOM AGC OUT
DIE size = 1.91 x 1.78 mm; PAD size = 100 x 100
µm
except for VSS PAD size 104 x 112
µm
Note:
Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note:
Coordinates are pad center points where origin has been located in the center of VDD pad
Pad Identification
Power Supply Voltage
Quartz Filter Output for Crystal
Quartz Filter Input for Crystal and
External Compensation Capacitor
Quartz Filter Output for External
Compensation Capacitor
AGC Capacitor
Receiver Output
Demodulator Capacitor
AGC On Control
Power Down Input
Positive Receiver Input
Negative Receiver Input
Power Supply Ground
Name
VDD
QOP
QI
QOM
AGC
OUT
DEC
AON
PDN
RFP
RFM
VSS
X-coordinate
0
µm
306
µm
549
µm
866
µm
1146
µm
1389
µm
1389
µm
1146
µm
829
µm
586
µm
269
µm
16
µm
Y-coordinate
0
µm
19
µm
19
µm
19
µm
19
µm
19
µm
1428
µm
1428
µm
1428
µm
1428
µm
1428
µm
1407
µm
1
2
3
Note
Notes:
1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced
(modulated)
-
the output is a current source/sink with |I
OUT
| > 5
µA
-
at power down the output is pulled to VSS (pull down switch)
2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)
- Internal pull-up with current < 1
µA
which is switched off at power down
3) PDN = VSS means receiver on; PDN = VDD means receiver off
-
Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up
(PDN=VSS) i.e. at the falling edge of PDN signal.
2 (8)
MAS [ MICRO ANALOG SYSTEMS ]
