DA6501.001
27 October 2008
BLOCK DIAGRAM
VDD
S&H
PI
NI
DIG
INT
DIG
FIL
EOC
ADC
SDA
SCL
COMMON
XCLR
GND
MCLK
Figure 1. MAS6501 block diagram
ABSOLUTE MAXIMUM RATINGS
All Voltages with Respect to Ground
Parameter
Symbol
Conditions
Min
Max
Unit
Supply Voltage
VCC
During conversion
No conversion
- 0.3
- 0.3
- 0.3
3.8
6.0
V
Voltage Range for All Pins
Latchup Current Limit
VIN + 0.3
V
ILUT
For all pins,
test according to
- 100
+ 100
mA
Micro Analog Systems
specification ESQ0141.
See note below.
Junction Temperature
Storage Temperature
TJmax
TS
+ 175
+125
°C
°C
- 55
Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not
operate under these conditions, but it will not be destroyed.
Note: This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages
(ESD).
Note: In latchup testing the supply voltages are connected normally to the tested device. Then pulsed test current is fed
to each input separately and device current consumption is observed. If the device current consumption increases
suddenly due to test current pulses and the abnormally high current consumption continues after test current pulses are
cut off then the device has gone to latch up. Current pulse is turned on for 10 ms and off for 20 ms.
RECOMMENDED OPERATION CONDITIONS
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Supply Voltage
VCC
TA
2.0
-20
2.35
+25
3.6
V
Operating Temperature
+60
°C
The device performance may deteriorate in the long run if the Recommended Operation Conditions limits are continuously exceeded.
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