DA6240.001
20 November 2006
SOLDERING INFORMATION
N For Lead-Free / Green QFN 3mm x 3mm x 0.75mm
Resistance to Soldering Heat
Maximum Temperature
According to RSH test IEC 68-2-58/20
260°C
3
Maximum Number of Reflow Cycles
Reflow profile
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
Lead Finish
EMBOSSED TAPE SPECIFICATIONS
P
1
D
0
PO
P2
T
X
E
W
F
B
0
R 0.25 typ
K0
X
A0
User Direction of Feed
Dimension
Min/Max
Unit
A
B
o
o
Mm
Mm
Mm
Mm
Mm
Mm
Mm
Mm
Mm
Mm
Mm
3.30
3.30
1.50 +0.1/-0.0
1.75
0.10
0.10
D
E
F
o
5.50
1.10
0.05
0.10
K
o
o
1
2
P
P
P
4.0
8.0
2.0
0.3
0.10
0.05
0.05
T
W
12.00 0.3
All dimensions in millimeters
8 (10)
MAS [ MICRO ANALOG SYSTEMS ]
