DA6240.001
20 November 2006
IC OUTLINES
EN1
EN2
CP1
CN2
DIN
VO1
VO2
MAS6240
1130 µm
DIE size = 1.13 x 1.20 mm; PAD size = 80 x 80 µm
DEVICE OUTLINE CONFIGURATION
QFN 3x3 12ld
7
1234
GAv
10
YWW 4
1
Top Marking Information:
1234 = Product Number
Av = Version Number
G = Lead Free, RoHS Compliant Package
YWW = Year Week
Pin nr.
Pin Name
Pin nr.
Pin Name
Pin nr.
Pin Name
Pin nr.
Pin Name
VO1
CN2
CP1
1
2
3
EN1
EN2
DIN
4
5
6
CN1
GND
VO2
7
8
9
10
11
12
VOUT
CP2
VIN
6 (10)