DA6116.010
5 October, 2017
SO-16 PACKAGE OUTLINE
16 LEAD SO OUTLINE (300 MIL BODY)
1.27
TYP.
0-0.13
RAD.
0.36
0.48
5° TYP.
5°TYP
0.33 x 45°
5° TYP.
0.25 RAD.
MIN.
SEATING
PLANE
5° TYP.
5° TYP.
0.86 TYP.
10.10
10.50
PIN 1
All dimensions are in accordance with JEDEC standard MS-013.
SOLDERING INFORMATION
For Lead-Free / Green
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
Solder plate 7.62 - 25.4 µm, material Matte Tin
Lead Finish
Rework guideline
According to JEDEC standard J-STD-020C the moisture sensitivity level (MSL) 3 package SO-16 can withstand
maximum 260C peak temperature for 20-40 seconds. The replacement part needs to be installed within 168
hours after opening of the moisture barrier bag or otherwise the part needs to be re-baked.
18 (20)
MAS [ MICRO ANALOG SYSTEMS ]
