DA1017.002
29 May, 2002
PAD LAYOUT
1588 µm
VSS RFI PDN QO
MAS1017
QI
2094 µm
VDD DEC AGC
PUP
DCF
DIE size = 2.09 x 1.59 mm; PAD size = 100 x 100
µm
Substrate is connected to VDD. Please make sure that VDD is bonded first.
Note: Coordinates are calculated using VDD as a centre point.
Pad Identification
Power Supply Voltage
Demodulator Capacitor
AGC Capacitor
Power Up Input
DCF Signal Output
Quarz Filter Input
Quarz Filter Output
Power Down Input
Receiver Input
Power Supply Ground
Name
VDD
DEC
AGC
PUP
DCF
QI
QO
PDN
RFI
VSS
X-coordinate
0
µm
244
µm
520
µm
759
µm
1075
µm
1038
µm
760
µm
483
µm
243
µm
-15
µm
Y-coordinate
0
µm
8
µm
8
µm
8
µm
8
µm
1625
µm
1625
µm
1625
µm
1625
µm
1605
µm
Note
1
2
3
Notes:
1) See power down control table below.
-
Internal pull-down resistor > 1 MΩ to VSS
2) DCF = VSS when carrier amplitude at maximum; DCF = VDD when carrier amplitude is reduced (25%
modulated)
-
the output is a current source/sink with |I
OUT
| > 5
µA
-
at power down the output is high impedance
3) See power down control logic table below.
- Internal pull-up resistor > 1MΩ to VDD
PDN
VSS
VSS
VDD
VDD
PUP
VSS
VDD
VSS
VDD
Power Down
NO
NO
YES (In power down if both PDN and PUP are left unconnected)
NO
2(6)
MAS [ MICRO ANALOG SYSTEMS ]
