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SMD150F-2018 参数 Datasheet PDF下载

SMD150F-2018图片预览
型号: SMD150F-2018
PDF下载: 下载PDF文件 查看货源
内容描述: PolySwitch自复式元件表面贴装器件 [PolySwitch Resettable Devices Surface-mount Devices]
分类和应用:
文件页数/大小: 20 页 / 299 K
品牌: MACOM [ Tyco Electronics ]
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Solder Reflow and Rework Recommendation for Surface-mount Devices  
Classification Reflow Profiles  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Average ramp up rate (TsMAX toTp)  
Preheat  
3°C/second max.  
3°C/second max.  
Temperature min. (TsMIN  
Temperature max. (TsMAX  
• Time (tsMIN to tsMAX  
)
100°C  
150°C  
)
150°C  
200°C  
)
60-120 seconds  
60-120 seconds  
Time maintained above:  
Temperature (TL)  
• Time (tL)  
183°C  
217°C  
60-150 seconds  
235°C  
60-150 seconds  
260°C  
Peak/Classification temperature (Tp)  
Time within 5°C of actual peak temperature  
Time (tp)  
20 seconds max.  
3°C/second max.  
6 minutes max.  
30 seconds max.  
3°C/second max.  
8 minutes max.  
Ramp down rate  
Time 25°C to peak temperature  
Note: All temperatures refer to topside of the package, measured on the package body surface.  
Figure S17  
tp  
Critical Zone  
TL toTp  
Tp  
Ramp up  
TL  
tL  
TsMAX  
TsMIN  
ts  
Ramp down  
Preheat  
25  
t 25˚C to Peak  
Time  
Reflow Profile  
Solder Reflow  
• Recommended reflow methods:  
- IR  
- Hot air  
- Nitrogen  
• Recommended maximum paste thickness: 0.25mm (0.010 inch)  
• Devices can be cleaned using standard methods and aqueous solvents.  
• We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed  
underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.  
10  
• Customer should validate that the solder paste amount and reflow recommendations meet its application.  
• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch  
devices. It is possible that raised features could negatively impact solderability performance of our devices.  
Rework  
• femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices.  
Please also avoid direct contact to the device.  
• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.  
107  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
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