Figure S5-S15 Typical Time-to-trip Curves at 20°C for Surface-mount Devices
Cont’d
Figure S14
SMDxxxF
A
B
E F G H
C
100
A
B
C
D
E
F
=
=
=
=
=
=
=
=
SMD030F
SMD050F
SMD075F, SMD075F/60
SMDH120
10
D
SMD100F, SMD100F/33
SMD125F
1
G
H
SMD260F
0.1
SMD300F, SMD300F/15
H
G
F
B
A
D
0.01
C
E
0.001
0.1
1
10
100
Fault Current (A)
Figure S15
SMD2xxxF
ABCDE
100
A
B
C
D
E
=
=
=
=
=
SMD150F, SMD150F/33
SMDH160
10
1
SMD185F
SMD200F
SMD250F
0.1
E
D
C
B
A
0.01
0.001
0.1
1
10
100
Fault Current (A)
Physical Characteristics and Environmental Specifications for Surface-mount Devices
Operating temperature range -40°C to 85°C, -40°C to 125°C for SMDH120 and SMDH160
Table S5
Physical Characteristics
Terminal pad material
100% matte tin with nickel underplate
Soldering characteristics
ANSI/J-STD-002 Category 3 for femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series
ANSI/J-STD-002 Category 1 for SMD series
10
Solder heat withstand
Flammability resistance
per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A
per IEC 695-2-2 Needle Flame Test for 20 sec.
Recommended storage conditions 40°C max, 70% R.H. max; devices may not meet specified ratings if storage conditions are exceeded.
Environmental Specifications
Test
Test Method
Conditions
Resistance Change
3% typical
Storage life
Raychem PS300, Section 5.3.2
60°C, 1000 hours
85°C, 1000 hours
85°C, 85% RH, 100 hours
85°C, -40°C (20 times)
125°C, -55°C (10 times)
per MIL-STD-883C
Freon
5% typical
Humidity aging
Thermal shock
Raychem PS300, Section 5.3.1
MIL-STD-202, Method 107G
1.2% typical
-33% typical
-33% typical
No change
Vibration
MIL-STD-883C
Solvent resistance
Raychem PS300, Section 5.2.2
No change
Trichloroethane
No change
Hydrocarbons
No change
104
RoHS Compliant, ELV Compliant
HF Halogen Free