Solder Reflow and Rework Recommendation for Surface-mount Devices
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp up rate (TsMAX toTp)
Preheat
3°C/second max.
3°C/second max.
• Temperature min. (TsMIN
• Temperature max. (TsMAX
• Time (tsMIN to tsMAX
)
100°C
150°C
)
150°C
200°C
)
60-120 seconds
60-180 seconds
Time maintained above:
• Temperature (TL)
• Time (tL)
183°C
217°C
30-70 seconds
240°C
30-70 seconds
260°C
Peak/Classification temperature (Tp)
Time within 5°C of actual peak temperature
Time (tp)
10-30 seconds
6°C/second max.
6 minutes max.
20-40 seconds
6°C/second max.
8 minutes max.
Ramp down rate
Time 25°C to peak temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
Figure S15
tp
Critical Zone
TL toTp
Tp
Ramp up
TL
tL
TsMAX
TsMIN
ts
Ramp down
Preheat
25
t 25˚C to Peak
Time
Reflow Profile
Solder Reflow
• Recommended reflow methods:
- IR
- Hot air
- Nitrogen
• Recommended maximum paste thickness: 0.25mm (0.010 inch)
• Devices can be cleaned using standard methods and aqueous solvents.
• We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed
underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
• Customer should validate that the solder paste amount and reflow recommendations meet its application.
15
• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch
devices. It is possible that raised features could negatively impact solderability performance of our devices.
Rework
• picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices. Please also avoid direct contact to the device.
• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.
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RoHS Compliant, ELV Compliant
TE [ TE CONNECTIVITY ]
