Reflow Soldering Characteristics
Temperature Profile forTable 8.
Table 10.
Profile Feature
Lead Free Assembly
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AverageꢀRamp-UpꢀRateꢀ(TsmaxꢀtoꢀTp)ꢀ
PreheatꢀTemperatureꢀMinꢀ(Tsmin)ꢀ
PreheatꢀTemperatureꢀMaxꢀ(Tsmax)ꢀ
PreheatꢀTimeꢀ(tsminꢀtoꢀtsmax)ꢀ
3°Cꢀ/ꢀsecondꢀmax
150°C
200°Cꢀ
60ꢀ-ꢀ180ꢀseconds
217°C
TimeꢀMaintainedꢀAboveꢀTemperatureꢀTLꢀ
TimeꢀMaintainedꢀAboveꢀTimeꢀ(tL)ꢀꢀ
Peakꢀ/ꢀClassificationꢀTemperatureꢀ(TP)ꢀ
TimeꢀWithinꢀ5°CꢀofꢀActualꢀPeakꢀTemperatureꢀ(tP)ꢀ
Ramp-DownꢀRateꢀ
60ꢀ-ꢀ150ꢀseconds
260°C
20ꢀ-ꢀ40ꢀseconds
6°Cꢀ/ꢀsecondꢀmax
8ꢀminutesꢀmaxꢀ
Timeꢀ25°CꢀtoꢀPeakꢀTemperatureꢀ
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Note forTable 10:
1.ꢀꢀAllꢀtemperaturesꢀreferꢀtoꢀtheꢀapplicationꢀPrintedꢀCircuitꢀBoardꢀ(PCB),ꢀmeasuredꢀonꢀtheꢀsurfaceꢀadjacentꢀtoꢀtheꢀpackageꢀbody.ꢀ
LUXEONꢀMꢀꢀDatasheetꢀDS103ꢀ20130418ꢀ©2013ꢀPhilipsꢀLumiledsꢀLightingꢀCompany.ꢀꢀꢀ
8
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