JEDEC Moisture Sensitivity
Table 5.
Soak Requirements
Standard
Floor Life
Level
Time
unlimited
Conditions
Time
Conditions
30°C /
85% RH
168h
+ 5 / - 0
85°C / 85%
RH
1
Reflow Soldering Characteristics
Figure 1. Temperature Profile for Table 6.
Table 6.
Profile Feature
Lead Free Assembly
3°C / second max
150°C
Average Ramp-Up Rate ( Tsmax to Tp )
Preheat Temperature Min ( Tsmin
Preheat Temperature Max ( Tsmax
Preheat Time ( tsmin to tsmax
)
)
200°C
)
60 - 180 seconds
217°C
Time Maintained Above Temperature TL
Time Maintained Above Time ( tL )
Peak / Classification Temperature ( TP )
Time Within 5°C of Actual Peak Temperature ( tP )
Ramp-Down Rate
60 - 150 seconds
260°C
20 - 40 seconds
6°C / second max
8 minutes max
Time 25°C to Peak Temperature
DS118 LUXEON Q Product Datasheet 20180327 ©2018 Lumileds Holding B.V. All rights reserved.
5
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