Absolute Maximum Ratings ꢀ Emitter
Table 7.
Parameter
White
[1]
DC Forward Current (mA)
700
Peak Pulsed Forward Current (mA)
Average Forward Current (mA)
1000
700
16,000V HBM
135
[2]
ESD Sensitivity
LED Junction Temperature (°C)
AluminumꢀCore PCB Temperature ( C)
Storage Temperature (°C)
[3]
70
ꢀ40 to +120
260 for 5 seconds max
[4]
Soldering Temperature (°C)
Notes for Table 7:
1. Proper current derating must be observed to maintain junction temperature below the maximum. For more information,
consult the LUXEON Design Guide, available upon request.
2. LEDs are not designed to be driven in reverse bias. Please consult Philips Lumileds' application brief AB11 for further
information.
3. Allowable maximum board temperature to avoid exceeding maximum junction temperature at maximum Vf limit at 700 mA
based on thermal resistance of Star assembly.
4. Measured at leads, during lead soldering and slug attach, body temperature must not exceed 120°C. LUXEON emitters
cannot be soldered by general IR or Vaporꢀphase reflow, nor by wave soldering. Lead soldering is limited to selective
heating of the leads, such as by hotꢀbar reflow, fiber focussed IR, or hand soldering. The package back plane (slug) may
not be attached by soldering, but rather with a thermally conductive adhesive. Electrical insulation between the slug and
the board is required. Please consult Philips Lumileds' Application Brief AB10 on LUXEON Emitter Assembly Information
for further details on assembly methods.
Wavelength Characteristics, TJ = 25ºC
1. 0
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
Wavelength
Wavelength (nm)
Figure 1. White Color Spectrum of typical CCT part, integrated measurement.
6
LUXEON V Portable Datasheet DS40 (8/06)
LUMILEDS [ LUMILEDS LIGHTING COMPANY ]
