ADVANCE INFORMATION L9D345G72BG5
4.5 Gb, DDR3, 64 M x 72 Integrated Module (IMOD)
TABLE 5: ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
MIN
MAX
UNITS
NOTES
Vcc Supply Voltage relative to Vss
Vcc Supply Voltage relative to VssQ
Voltage on any pin relative to Vss
Operating Case Temperature
Operating Case Temperature
Operating Case Temperature
Storage Temperature
-0.4
1.975
V
1
Vcc
-0.4
-0.4
0
1.975
1.975
85
1
V
VccQ
V
1
VIN, VOUT
TcIndustrial
TcExtended
TcMiltemp
TSTG
°C
°C
°C
°C
2,3
2,3
2,3
2,3
-40
-55
-55
105
125
120
NOTES:
1. Vcc and VccQ must be within 300mV of each other at all times and VREF must not be greater than 0.6 x VccQ. When Vcc and
VccQ are less than 500MV, VREF may be ≤300mV.
2. Max operating case temperature. Tc is measured in the center of the package.
3. Device Functionality is not guaranteed if the DRAM device exceeds the Maximum Tc during operation.
TABLE 6: INPUT/OUTPUT CAPACITANCE
Capacitance Parameter
PACKAGE OUTLINE DIMENSIONS
DDR3-800
DDR3-1066
DDR3-1333
Symbol
MIN MAX
MIN
3.1
0
MAX MIN MAX UNITS NOTES
6.2
0.2
3.0
3.0
0.2
0.3
0.3
0.3
5.3
3.1
0
6.2
0.2
3.0
3.0
0.2
0.3
0.3
0.3
5.5
3.0
0
6.1
0.2
2.5
2.5
0.2
0.3
0.3
0.3
5.1
pF
pF
pF
pF
pF
pF
pF
pF
pF
CK and CK\
CCK
CDCK
∆C: CK to CK\
2
3
3
4
6
7
5
1.5
1.5
0
1.5
1.5
0
1.5
1.5
0
Single-end I/O: DQ, DM
Differential I/O: DQS, DQS\
∆C: DQS to DQS\
C10
C10
CCCQS
CDI0
-0.5
-0.5
-0.5
2.9
-0.5
-0.5
-0.5
2.9
-0.5
-0.5
-0.5
2.9
∆C: DQ to DQS
∆C: CNTL to CK
CDI_CNTL
CDI_CMD_ADDR
CI_Shared
∆C: cmd_ADDR to CK
Inputs (RAS\, CAS\, WE\, CS\, CKE, ADDR)
NOTES:
1. Vcc = +1.5V± 0.075mV, VccQ = Vcc, VREF = Vss, f= 100MHz, Tc = 25°C, VOUT (DC) = 0.5 x VccQ, VOUT (peak to peak) = 0.1V
2. DM input is grouped with I/O pins, reflecting the signal is grouped with DQ and therefore matched in loading.
3. CCCQS is for DQS vs. DQS\
4. CDIO = CIO (DQ) - 0.5 x (CIO [DQS] + CIO [DQS\])
5. Excludes CK, CK\
6. CDI_CNTL = CI(CNTL) - 0.5 x (CCK[CK] + CCK [CK\]); CNTL = ODT, CS\ and CKE
7. CDI_CMD_ADDR = CI (CMD_ADDR) - 0.5 x (CCK [CK] + CCK [CK\]); CMD = RAS\, CAS\, and WE\ ADDR = [n:0]
LOGIC Devices Incorporated
www.logicdevices.com
High Performance, Integrated Memory Module Product
12
Jul 06, 2009 LDS-L9D345G72BG5-A
LOGIC [ LOGIC DEVICES INCORPORATED ]
