LTC2996
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
0.70 ±0.05
3.55 ±0.05
2.15 ±0.05 (2 SIDES)
1.65 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.125
0.40 ±0.10
TYP
6
10
3.00 ±0.10
(4 SIDES)
1.65 ±0.10
(2 SIDES)
PIN 1 NOTCH
R = 0.20 OR
PIN 1
TOP MARK
(SEE NOTE 6)
0.35 × 45°
CHAMFER
(DD) DFN REV C 0310
5
1
0.25 ±0.05
0.50 BSC
0.75 ±0.05
0.200 REF
2.38 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
2996f
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tionthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
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