LT3653
PACKAGE DESCRIPTION
DCB Package
8-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1718 Rev A)
0.70 p0.05
1.35 p0.05
1.65 p 0.05
3.50 p0.05
2.10 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.45 BSC
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.115
2.00 p0.10
(2 SIDES)
0.40 p 0.10
TYP
5
R = 0.05
TYP
8
1.35 p0.10
1.65 p 0.10
3.00 p0.10
(2 SIDES)
PIN 1 NOTCH
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
R = 0.20 OR 0.25
s 45o CHAMFER
(DCB8) DFN 0106 REV A
4
1
0.23 p 0.05
0.45 BSC
0.75 p0.05
0.200 REF
1.35 REF
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3653f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
Linear [ Linear ]
