LT3694/LT3694-1
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev I)
Exposed Pad Variation CB
6.40 – 6.60*
3.86
(.152)
(.252 – .260)
3.86
(.152)
20 1918 17 16 15 14 1312 11
6.60 ±0.10
2.74
(.108)
4.50 ±0.10
6.40
(.252)
BSC
2.74
(.108)
SEE NOTE 4
0.45 ±0.05
1.05 ±0.10
0.65 BSC
5
7
8
1
2
3
4
6
9 10
RECOMMENDED SOLDER PAD LAYOUT
1.20
(.047)
MAX
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
0.65
(.0256)
BSC
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
0.05 – 0.15
(.002 – .006)
0.195 – 0.30
FE20 (CB) TSSOP REV I 0211
(.0077 – .0118)
TYP
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
MILLIMETERS
(INCHES)
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
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Linear [ Linear ]
