LT3433
U
TYPICAL APPLICATIO
Burst Only Low Noise 5V Maintenance Supply
D
D
S1
B160A
S2
B160A
L1
33µH
D1
1N4148
V
SW_L
BST
C1
0.1µF
SW_H PWRGND
LT3433
V
IN
4V TO 60V
V
V
IN
OUT
D2
1N4148
+
C7
2.2µF
BURST_EN
V
BIAS
C6 100pF
C2
0.1µF
V
C
SHDN
SS
V
FB
V
OUT
R2
510k
5%
R1
5V
IN
SHDN
OUT
BYP
SGND
C4
0.01µF
C5
2.2µF
2.2M
LT1761-5
10mA
5%
GND
C3
10µF
3433 TA03
U
PACKAGE DESCRIPTIO
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
3.58
(.141)
16 1514 13 12 1110
9
6.60 ±0.10
4.50 ±0.10
2.94
(.116)
SEE NOTE 4
2.94
(.116)
6.40
BSC
0.45 ±0.05
1.05 ±0.10
0.65 BSC
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT
1.10
(.0433)
MAX
4.30 – 4.50*
(.169 – .177)
0° – 8°
0.65
(.0256)
BSC
0.45 – 0.75
0.09 – 0.20
0.05 – 0.15
(.018 – .030)
(.0036 – .0079)
(.002 – .006)
0.195 – 0.30
(.0077 – .0118)
FE16 (BB) TSSOP 0203
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
MILLIMETERS
(INCHES)
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
3433ia
11
Linear [ Linear ]
