LT1469
PACKAGE DESCRIPTION
DF Package
12-Lead Plastic DFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1773 Rev Ø)
2.50 REF
0.70 0.05
3.38 0.05
2.65 0.05
4.50 0.05
3.10 0.05
PACKAGE OUTLINE
0.25 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 0.10
(4 SIDES)
2.50 REF
7
12
0.40 0.10
3.38 0.10
2.65 0.10
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45°
PIN 1
TOP MARK
(NOTE 6)
CHAMFER
(DF12) DFN 0806 REV Ø
6
R = 0.115
TYP
1
0.25 0.05
0.50 BSC
0.200 REF
0.75 0.05
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
1469fa
17
Linear [ Linear ]
