LT1469-2
PACKAGE DESCRIPTION
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(Reference LTC DWG # 0±-0ꢂ-1610)
.189 – .197
(4.801 – 5.004)
NOTE 3
.045 ±.005
.050 BSC
7
5
8
6
.245
MIN
.160 ±.005
.150 – .157
(3.810 – 3.988)
NOTE 3
.228 – .244
(5.791 – 6.197)
.030 ±.005
TYP
1
2
3
4
RECOMMENDED SOLDER PAD LAYOUT
.010 – .020
(0.254 – 0.508)
× 45°
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
.016 – .050
(0.406 – 1.270)
.050
(1.270)
BSC
.014 – .019
(0.355 – 0.483)
TYP
NOTE:
INCHES
1. DIMENSIONS IN
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
SO8 0303
DF Package
12-Lead Plastic DFN (4mm × 4mm)
(Reference LTC DWG # 0±-0ꢂ-1773 Rev Ø)
4.00 ± 0.10
(4 SIDES)
2.50 REF
2.50 REF
7
12
0.70 ±0.05
0.40 ± 0.10
3.38 ±0.10
3.38 ±0.05
2.65 ± 0.05
4.50 ± 0.05
3.10 ± 0.05
2.65 ± 0.10
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45°
PIN 1
TOP MARK
(NOTE 6)
PACKAGE
OUTLINE
CHAMFER
(DF12) DFN 0806 REV
Ø
6
1
0.25 ± 0.05
0.50 BSC
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
0.200 REF
0.75 ± 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.00 – 0.05
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
14692f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
Linear [ Linear ]
