LTC3607
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691 Rev Ø)
0.70 ±0.05
3.50 ±0.05
2.10 ±0.05
1.45 ±0.05
(4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
R = 0.115
TYP
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
15 16
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
1
2
1.45 ± 0.10
(4-SIDES)
(UD16) QFN 0904
0.200 REF
0.25 ±0.05
0.00 – 0.05
0.50 BSC
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3607fb
For more information www.linear.com/LTC3607
17
Linear Systems [ Linear Systems ]
