Data Sheet
February 16, 2009
QSW025A0B Series Power Modules; DC-DC Converters
36 – 75Vdc Input; 12Vdc Output; 25A Output Current
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such
Layout Considerations
The QSW025 power module series are low profile in
order to be used in fine pitch system card architectures.
As such, component clearance between the bottom of
the power module and the mounting board is limited.
Avoid placing copper areas on the outer layer directly
underneath the power module. Also avoid placing via
interconnects underneath the power module.
that the temperature of the power module board is kept
below 210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole Pb
or Pb-free reflow process. If additional information is
needed, please consult with your Lineage Power
representative for more details.
For additional layout guide-lines, refer to FLTR100V10
Data Sheet.
Post Solder Cleaning and Drying
Considerations
Through-Hole Lead-Free Soldering
Information
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board
The RoHS-compliant, Z version, through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. The non-Z version products use
lead-tin (Pb/Sn) solder and RoHS-compliant
components. Both version modules are designed to be
processed through single or dual wave soldering
machines. The pins have an RoHS-compliant, pure tin
finish that is compatible with both Pb and Pb-free wave
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
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LINEAGE POWER