Data Sheet
KW0006-010 Series Power Modules:
September 9, 2008
36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 6 to 10A Output Current
must be observed when soldering these units. Failure
Surface Mount Information
to observe these instructions may result in the failure of
or cause damage to the modules, and can adversely
affect long-term reliability.
Pick and Place
The KW006/010 modules use an open frame
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC.
Typically, the eutectic solder melts at 183oC, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies currently
used in the industry. These surface mount power
modules can be reliably soldered using natural forced
convection, IR (radiant infrared), or a combination of
convection/IR. For reliable soldering the solder reflow
profile should be established by accurately measuring
the modules CP connector temperatures.
construction and are designed for a fully automated
assembly process. The pick and place location on the
module is the larger magnetic core as shown in Figure
23. The modules are fitted with a label which meets all
the requirements for surface mount processing, as well
as safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
300
Peak Temp 235oC
250
Cooling
zo ne
Heat zone
max 4oCs-1
200
150
10 0
50
1- 4 oCs-1
Soak zone
30-240s
T
lim above
205oC
Preheat zone
max 4oCs-1
0
REFLOW TIME (S)
Figure 24. Reflow Profile for Tin/Lead (Sn/Pb)
process
Figure 23. Pick and Place Location.
Nozzle Recommendations
240
235
230
225
220
215
210
205
200
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The recommended nozzle diameter for reliable
operation is 6mm. Oblong or oval nozzles up to 11 x 6
mm may also be used within the space available.
0
10
20
30
40
50
60
Tin Lead Soldering
Figure 25. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
The KW006/010 power modules (both non-Z and –Z
codes) can be soldered either in a conventional
Tin/Lead (Sn/Pb) process. The non-Z version of the
KW006/010 modules are RoHS compliant with the lead
exception. Lead based solder paste is used in the
soldering process during the manufacturing of these
modules. These modules can only be soldered in
conventional Tin/lead (Sn/Pb) process. It is
Lead Free Soldering
The –Z version of the KW006/010 modules are lead-
free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. The non-Z version of the
KW006/010 modules are RoHS compliant with the lead
exception. Lead based solder paste is used in the
soldering process during the manufacturing of these
modules. These modules can only be soldered in
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions
LINEAGE POWER
11
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
