Data Sheet
KNW013-020 Series Power Modules:
June 29, 2009
36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current
Surface Mount Information (continued)
300
250
200
150
100
50
Per J-STD-020 Rev. C
Lead Free Soldering
Peak Temp 260°C
The –Z version of the KNW013-020 modules are
lead-free (Pb-free) and RoHS compliant, and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. The non-Z version of the
KNW006/010 modules are RoHS compliant with the
lead exception. Lead based solder paste is used in
the soldering process during the manufacturing of
these modules. These modules can only be soldered
in conventional Tin/lead (Sn/Pb) process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Cooling
Zone
* Min. Time Above 235°C
15 Seconds
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
0
Reflow Time (Seconds)
Figure 25. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 25.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, and, for Pb-free solder, the
recommended pot temperature is 270°C max. Not all
RoHS-compliant through-hole products can be
processed with paste-through-hole Pb or Pb-free
reflow process. If additional information is needed,
please consult with your Lineage Power
MSL Rating
The KNW013-020 modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
representative for more details.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
LINEAGE POWER
12
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
