Data Sheet
KNW013-020 Series Power Modules:
June 29, 2009
36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current
In a conventional Tin/Lead (Sn/Pb) solder process
Surface Mount Information
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Pick and Place
The KNW013-020 modules use an open frame
construction and are designed for a fully automated
assembly process. The pick and place locations on
the module are the larger magnetic core or the
transistor package as shown in Figure 22. The
modules are fitted with a label which meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
300
Peak Temp 235oC
250
Cooling
zone
Heat zone
max 4oCs-1
200
150
10 0
50
1- 4 oCs-1
Soak zone
30-240s
T
lim above
205oC
Preheat zone
max4oCs-1
0
REFLOW TIME (S)
Figure 22. Pick and Place Locations.
Nozzle Recommendations
Figure 23. Reflow Profile for Tin/Lead (Sn/Pb)
process
240
235
230
225
220
215
210
205
200
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The recommended nozzle diameter for reliable
operation is 5mm. Oblong or oval nozzles up to 11 x 5
mm may also be used within the space available.
Tin Lead Soldering
The KNW013-020 power modules (both non-Z and –Z
codes) can be soldered either in a conventional
Tin/Lead (Sn/Pb) process. The non-Z version of the
KNW013-020 modules are RoHS compliant with the
lead exception. Lead based solder paste is used in
the soldering process during the manufacturing of
these modules. These modules can only be soldered
in conventional Tin/lead (Sn/Pb) process. It is
0
10
20
30
40
50
60
Figure 24. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
LINEAGE POWER
11
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
