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JBW050F 参数 Datasheet PDF下载

JBW050F图片预览
型号: JBW050F
PDF下载: 下载PDF文件 查看货源
内容描述: 36至75 VDC输入, 3.3 Vdc输出; 33 W¯¯ [36 to 75 Vdc Input, 3.3 Vdc Output; 33 W]
分类和应用:
文件页数/大小: 16 页 / 334 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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JBW050F Power Modules: dc-dc Converter;  
36 to 75 Vdc Input, 3.3 Vdc Output; 33 W  
Data Sheet  
September 20, 2004  
Thermal Considerations (continued)  
12  
10  
8
Heat Transfer with Heat Sinks (continued)  
8
6
MAX CASE TEMP  
3.0 m/s (600 ft./min.)  
2.0 m/s (400 ft./min.)  
1.0 m/s (200 ft./min.)  
0.5 m/s (100 ft./min.)  
0.25 m/s (50 ft./min.)  
7
NO HEAT SINK  
1/4 in. HEAT SINK  
1/2 in. HEAT SINK  
1 in. HEAT SINK  
4
2
0
6
5
1 1/2 in. HEAT SINK  
NATURAL CONVECTION  
4
0
20  
40  
60  
80  
100  
120  
LOCAL AMBIENT TEMPERATURE, TA (˚C)  
3
2
1-0705  
Figure 19. Forced Convection Power Derating with  
No Heat Sink; Either Orientation  
1
0
0
0.25 0.51 0.76 1.02 1.27  
1.52 1.78 2.03  
(50) (100) (150) (200) (250) (300) (350) (400)  
Heat Transfer with Heat Sinks  
AIR VELOCITY, ms-1 (ft./min.)  
8-1052.a  
The power modules have through-threaded, M3 x 0.5  
mounting holes, which enable heat sinks or cold plates  
to attach to the module. The mounting torque must not  
exceed 0.56 N-m (5 in.-lb.). For a screw attachment  
from the pin side, the recommended hole size on the  
customer’s PWB around the mounting holes is  
0.130 ± 0.005 inches. If a larger hole is used, the  
mounting torque from the pin side must not exceed  
0.25 N-m (2.2 in.-lb.).  
Figure 20. Case-to-Ambient Thermal Resistance  
Curves; Either Orientation  
These measured resistances are from heat transfer  
from the sides and bottom of the module as well as the  
top side with the attached heat sink; therefore, the  
case-to-ambient thermal resistances shown are gener-  
ally lower than the resistance of the heat sink by itself.  
The module used to collect the data in Figure 20 had a  
thermal-conductive dry pad between the case and the  
heat sink to minimize contact resistance. The use of  
Figure 20 is shown in the following example.  
Thermal derating with heat sinks is expressed by using  
the overall thermal resistance of the module. Total  
module thermal resistance (θca) is defined as the max-  
imum case temperature rise (TC, max) divided by the  
module power dissipation (PD):  
Example  
If an 85 °C case temperature is desired, what is the  
minimum airflow necessary? Assume the JBW050F  
module is operating at VI = 54 V and an output current  
of 10 A, maximum ambient air temperature of 70 °C,  
and the heat sink is 1/2 inch.  
(TC TA)  
TC, max  
--------------------  
------------------------  
=
θca =  
PD  
PD  
The location to measure case temperature (TC) is  
shown in Figure 17. Case-to-ambient thermal resis-  
tance vs. airflow is shown, for various heat sink config-  
urations and heights, in Figure 20. These curves were  
obtained by experimental testing of heat sinks, which  
are offered in the product catalog.  
Solution  
Given: VI = 54 V  
IO = 10 A  
TA = 70 °C  
TC = 85 °C  
Heat sink = 1/2 in.  
Determine PD by using Figure 18:  
PD = 7.7 W  
Then solve the following equation:  
T
C TA  
-------------------  
PD  
θca =  
θca =  
85 70  
-----------------  
7.7  
θca = 1.95 °C/W  
12  
Tyco Electronics Power Systems