JBW030-Series Power Module: dc-dc Converters
36-75 Vdc Input; 3.3 Vdc and 5 Vdc Outputs; 30 W
Data Sheet
March 27, 2008
Although the previous example uses 100 °C as the
maximum case temperature, for extremely high reliabil-
ity applications, one can use a lower temperature for
TC, max.
Thermal Considerations (continued)
Heat Sink Selection (continued)
It is important to point out that the thermal resistances
shown in Figure 22 are for heat transfer from the sides
and bottom of the module as well as the top side with
the attached heat sink; therefore, the case-to-ambient
thermal resistances shown will generally be lower than
the resistance of the heat sink by itself. The data in Fig-
ure 22 was taken with a thermally conductive dry pad
between the case and the heat sink to minimize contact
resistance (typically 0.1 °C/W to 0.3 °C/W).
8
7
NO HEAT SINK
1/4 in. HEAT SINK
1/2 in. HEAT SINK
1 in. HEAT SINK
6
5
1 1/2 in. HEAT SINK
4
3
2
For a more detailed explanation of thermal energy
management for this series of power modules as well
as more details on available heat sinks, please request
the following technical note: Thermal Energy Manage-
ment for JC- and JW-Series 30 Watt Board-Mounted
Power Modules (TN97-016EPS).
1
0
0
0.25 0.51 0.76 1.02 1.27 1.52 1.78 2.03
(50) (100) (150) (200) (250) (300) (350) (400)
AIR VELOCITY,ms -1(ft./min.)
8-1052(C).a
Layout Considerations
Figure 22. Case-to-Ambient Thermal Resistance
vs. Air Velocity Curves; Either
Orientation
Copper paths must not be routed beneath the power
module standoffs.
Lineage Power
13
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
