欢迎访问ic37.com |
会员登录 免费注册
发布采购

HC010A0F1-SZ 参数 Datasheet PDF下载

HC010A0F1-SZ图片预览
型号: HC010A0F1-SZ
PDF下载: 下载PDF文件 查看货源
内容描述: 18-36VDC输入; 3.3V和5V直流输出; 6.6A - 10A输出电流 [18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current]
分类和应用:
文件页数/大小: 19 页 / 515 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
 浏览型号HC010A0F1-SZ的Datasheet PDF文件第11页浏览型号HC010A0F1-SZ的Datasheet PDF文件第12页浏览型号HC010A0F1-SZ的Datasheet PDF文件第13页浏览型号HC010A0F1-SZ的Datasheet PDF文件第14页浏览型号HC010A0F1-SZ的Datasheet PDF文件第15页浏览型号HC010A0F1-SZ的Datasheet PDF文件第16页浏览型号HC010A0F1-SZ的Datasheet PDF文件第17页浏览型号HC010A0F1-SZ的Datasheet PDF文件第19页  
Data Sheet  
HC006/010 Series DC-DC Power Module:  
May 16, 2008  
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current  
stored at the following conditions: < 40° C, < 90%  
relative humidity.  
Surface Mount Information (continued)  
MSL Rating  
240  
235  
230  
225  
220  
215  
210  
205  
200  
The HW/HC series SMT modules have a MSL rating  
of 1.  
Post Solder Cleaning and Drying  
Considerations  
Post solder cleaning is usually the final circuit-board  
assembly process prior to electrical board testing. The  
result of inadequate cleaning and drying can affect  
both the reliability of a power module and the  
testability of the finished circuit-board assembly. For  
guidance on appropriate soldering, cleaning and  
drying procedures, refer to Lineage Power Board  
Mounted Power Modules: Soldering and Cleaning  
Application Note (AP01-056EPS).  
0
10  
20  
30  
40  
50  
60  
TIME LIMIT (S)  
Figure 25. Time Limit Curve Above 205oC Reflow .  
300  
Per J-STD-020 Rev. C  
Lead Free Soldering  
250  
Peak Temp 245° C  
Cooling Zone  
4° C / second  
The SMT modules of the HW/HC series are lead-free  
(Pb-free) and RoHS compliant and are both forward  
and backward compatible in a Pb-free and a SnPb  
soldering process. Failure to observe the instructions  
below may result in the failure of or cause damage to  
the modules and can adversely affect long-term  
reliability.  
200  
* Min. Time Above 235° C  
15 seconds  
150  
Heating Zone  
* Time Above 217° C  
1° C / second  
60 seconds  
100  
50  
Pb-free Reflow Profile  
0
Reflow Time (in seconds)  
Power Systems will comply with J-STD-020 Rev. C  
(Moisture/Reflow Sensitivity Classification for  
Nonhermetic Solid State Surface Mount Devices) for  
both Pb-free solder profiles and MSL classification  
procedures. This standard provides a recommended  
forced-air-convection reflow profile based on the  
volume and thickness of the package (table 4-2). The  
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).  
The recommended linear reflow profile using  
Sn/Ag/Cu solder is shown in Figure. 26.  
Figure 26. Recommended linear reflow profile  
using Sn/Ag/Cu solder.  
Solder Ball and Cleanliness Requirements  
The open frame (no case or potting) power module  
will meet the solder ball requirements per  
J-STD-001B. These requirements state that solder  
balls must neither be loose nor violate the power  
module minimum electrical spacing.  
The cleanliness designator of the open frame power  
module is C00 (per J specification).  
Storage and Handling  
The recommended storage environment and handling  
procedures for moisture-sensitive surface mount  
packages is detailed in J-STD-033 Rev. A (Handling,  
Packing, Shipping and Use of Moisture/Reflow  
Sensitive Surface Mount Devices). Moisture barrier  
bags (MBB) with desiccant are required for MSL  
ratings of 2 or greater. These sealed packages  
should not be broken until time of use. Once the  
original package is broken, the floor life of the product  
at conditions of 30°C and 60% relative humidity  
varies according to the MSL rating (see J-STD-033A).  
The shelf life for dry packed SMT packages will be a  
minimum of 12 months from the bag seal date, when  
LINEAGE POWER  
18  
 复制成功!