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HC010A0F1-SZ 参数 Datasheet PDF下载

HC010A0F1-SZ图片预览
型号: HC010A0F1-SZ
PDF下载: 下载PDF文件 查看货源
内容描述: 18-36VDC输入; 3.3V和5V直流输出; 6.6A - 10A输出电流 [18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current]
分类和应用:
文件页数/大小: 19 页 / 515 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
HC006/010 Series DC-DC Power Module:  
May 16, 2008  
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current  
damage to the modules, and can adversely affect  
long-term reliability.  
Surface Mount Information (continued)  
The surface mountable modules in the HC family use  
our newest SMT technology called “Column Pin” (CP)  
connectors. Fig 23 shows the new CP connector  
before and after reflow soldering onto the end-board  
assembly.  
HC Board  
X
14mm  
(0.57in)  
Insulator  
Solder Ball  
21mm  
End assembly PCB  
(0.84in)  
Note: All dimensions in mm.  
Figure 22. Pick and Place Location.  
Z Plane Height  
Figure 23. Column Pin Connector Before and After  
Reflow Soldering.  
The CP is constructed from a solid copper pin with an  
integral solder ball attached, which is composed of  
tin/lead (Sn/Pb) solder. The CP connector design is  
able to compensate for large amounts of co-planarity  
and still ensure a reliable SMT solder joint.  
The ‘Z’ plane height of the pick and place location is  
7.50mm nominal with an RSS tolerance of +/-0.25  
mm.  
Nozzle Recommendations  
Typically, the eutectic solder melts at 183oC, wets the  
land, and subsequently wicks the device connection.  
Sufficient time must be allowed to fuse the plating on  
the connection to ensure a reliable solder joint. There  
are several types of SMT reflow technologies  
currently used in the industry. These surface mount  
power modules can be reliably soldered using natural  
forced convection, IR (radiant infrared), or a  
combination of convection/IR. For reliable soldering  
the solder reflow profile should be established by  
accurately measuring the modules CP connector  
temperatures.  
The module weight has been kept to a minimum by  
using open frame construction. Even so, they have a  
relatively large mass when compared with  
conventional SMT components. Variables such as  
nozzle size, tip style, vacuum pressure and placement  
speed should be considered to optimize this process.  
The minimum recommended nozzle diameter for  
reliable operation is 6mm. The maximum nozzle outer  
diameter, which will safely fit within the allowable  
component spacing, is 9 mm.  
Oblong or oval nozzles up to 11 x 9 mm may also be  
used within the space available.  
300  
For further information please contact your local  
Lineage Power Technical Sales Representative.  
Peak Temp 235oC  
250  
Cooling  
zone  
1- 4 oCs-1  
Reflow Soldering Information  
Heat zone  
max 4oCs-1  
200  
150  
10 0  
50  
The HC family of power modules is available for either  
Through-Hole (TH) or Surface Mount (SMT)  
soldering. These power modules are large mass, low  
thermal resistance devices and typically heat up  
slower than other SMT components. It is  
recommended that the customer review data sheets  
in order to customize the solder reflow profile for each  
application board assembly.  
Soak zone  
30-240s  
T
lim above  
205oC  
Preheat zone  
max 4oCs-1  
0
The following instructions must be observed when  
SMT soldering these units. Failure to observe these  
instructions may result in the failure of or cause  
REFLOW TIME (S)  
Figure 24. Recommended Reflow Profile  
LINEAGE POWER  
17  
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