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FNW500R4 参数 Datasheet PDF下载

FNW500R4图片预览
型号: FNW500R4
PDF下载: 下载PDF文件 查看货源
内容描述: 36 - 75 VDC输入; 28VDC输出; 500W输出 [36 - 75 Vdc Input; 28Vdc Output; 500W Output]
分类和应用:
文件页数/大小: 13 页 / 341 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
FNW500R Power Modules; DC-DC Converters  
36 – 75 Vdc Input; 28Vdc Output; 500W Output  
September 8, 2008  
Thermal Considerations  
600  
500  
400  
300  
200  
100  
0
The power modules operate in a variety of thermal  
environments; however, sufficient cooling should be  
provided to help ensure reliable operation of the unit.  
Heat-dissipating components inside the unit are  
thermally coupled to the case. Heat is removed by  
conduction, convection, and radiation to the  
surrounding environment. Proper cooling can be  
verified by measuring the case temperature. Peak  
temperature (TC) occurs at the position indicated in  
Figure 14.  
60  
65  
70  
75  
80  
85  
90  
95  
100  
Considerations include ambient temperature, airflow,  
module power dissipation, and the need for increased  
reliability. A reduction in the operating temperature of  
the module will result in an increase in reliability. The  
thermal data presented here is based on physical  
measurements taken in a wind tunnel.  
Tcase (C)  
Figure 15. Output Power Derating for FNW500R in  
Conduction cooling (cold plate) applications;  
Ta <72ºC in vicinity of module interior; VIN = VIN, NOM  
Layout Considerations  
For reliable operation this temperature should not  
exceed 100ºC.  
The FNW500R power module series are aluminum  
base board packaged style, as such; component  
clearance between the bottom of the power module  
and the mounting (Host) board is limited. Avoid placing  
copper areas on the outer layer directly underneath the  
power module.  
TOP VIEW  
Post Solder Cleaning and Drying  
Considerations  
Post solder cleaning is usually the final circuit-board  
assembly process prior to electrical board testing. The  
result of inadequate cleaning and drying can affect both  
the reliability of a power module and the testability of  
the finished circuit-board assembly. For guidance on  
appropriate soldering, cleaning and drying procedures,  
refer to Lineage Power Board Mounted Power  
23mm  
45mm  
Figure 14. Case (Tc ) Temperature Measurement  
Location (top view).  
Modules: Soldering and Cleaning Application Note.  
The output power of the module should not exceed the  
rated power for the module as listed in the ordering  
Information table.  
Although the maximum Tc temperature of the power  
modules is 100°C, you can limit this temperature to a  
lower value for extremely high reliability.  
Thermal Derating  
The curve in Figure 15 depicts the temperature/output  
power derating curve for conduction cooling type  
applications. These applications typically will provide a  
low thermal impedance cooling interface that is  
attached to the top surface of the module and is  
maintained at or below the TC temperature. The internal  
air surrounding the module is still and is held below  
72°C. The module will deliver full power when the case  
(TC) Temperature Measurement Location is maintained  
at or below 95°C. For temperatures above 95°C, the  
output current must be limited by the derating curve.  
For other applications, such as force air cooling, the  
FNW500R power module has large power dissipation,  
a customized heatsink is required for application.  
LINEAGE POWER  
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