Data Sheet
FLT012A0Z/FLT012A0-SZ Input Filter Modules
February 9, 2012
75Vdc Input Voltage Maximum, 12A Output Current Maximum
Bottom Side / First Side Assembly
240
235
230
225
220
215
210
205
200
This module is not recommended for assembly on the
bottom side of a customer board. If such an assembly
is attempted, components may fall off the module
during the second reflow process.
Tin Lead Soldering
The FLT012A0-SZ power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
0
10
20
30
40
50
60
Figure 14. Time Limit Curve Above 205oC Reflow
for Tin Lead (Sn/Pb) process.
Lead Free Soldering
The FLT012A0-SZ SMT modules are lead-free (Pb-
free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow
Sensitivity
Classification
for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 15. Soldering
outside of the recommended profile requires testing to
verify results and performance.
300
Peak Temp 235oC
250
Cooling
zo ne
1- 4 oCs-1
Heat zone
max 4oCs-1
200
150
10 0
50
MSL Rating
Soak zone
30-240s
The FLT012A0-SRZ SMT modules have a MSL rating
of 2a.
T
lim above
205oC
Storage and Handling
Preheat zone
max 4oCs-1
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of <= 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
0
REFLOW TIME (S)
Figure 13. Reflow Profile for Tin/Lead (Sn/Pb)
process.
LINEAGE POWER
8
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
