Data Sheet
FLT012A0Z/FLT012A0-SZ Input Filter Modules
February 9, 2012
75Vdc Input Voltage Maximum, 12A Output Current Maximum
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should
always be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test set-
up is shown in Fig. 10. Note that the airflow is parallel
to the long axis of the module as shown in Fig. 10.
Figure 11. T
location.
Temperature measurement
ref
25.4_
(1.0)
Wind Tunnel
PWBs
Surface Mount Information
Power Module
Pick and Place
The FLT012A0-SR SMT modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
76.2_
(3.0)
and place operations.
The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and location of manufacture.
x
Probe Location
for measuring
airflow and
ambient
12.7_
(0.50)
temperature
Nozzle Recommendations
Air
flow
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 5 mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
Figure 10. Thermal Test Set-up.
The thermal reference point, Tref used in the
specifications is shown in Figure 11. For reliable
operation this temperature should not exceed 130oC.
The output power of the module should not exceed
the rated output current of the module.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Figure 12. Pick and Place Location.
LINEAGE POWER
7
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
