Data Sheet
EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
December 12, 2008
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 51.
Surface Mount Information (continued)
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb
solder is shown in Figure 49 and 50. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
300
250
Peak Temp 235oC
Cooling
200
250
Zone
* Min. Time Above 235°C
Cooling
zone
1- 4 oCs-1
15 Seconds
Heat zone
max 4oCs-1
150
200
150
10 0
50
Heating Zone
*Time Above 217°C
1°C/Second
60 Seconds
100
50
0
Soak zone
30-240s
T
lim above
205oC
Reflow Time (Seconds)
Preheat zone
max 4oCs-1
Figure 51. Recommended linear reflow profile
using Sn/Ag/Cu solder.
0
REFLOW TIME (S)
MSL Rating
Figure 49. Recommended Reflow Profile for Sn/Pb
Solder.
The EQW series SMT modules have a MSL rating of
2.
240
235
230
225
220
215
210
205
200
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
0
10
20
30
40
50
60
TIME LIMIT (S)
Figure 50. Time Limit, Tlim, Curve Above 205oC
Reflow .
Lead Free Soldering
Post Solder Cleaning and Drying
Considerations
The –Z version SMT modules of EQW series are
lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
LINEAGE POWER
23
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
