Data Sheet
EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
December 12, 2008
relatively large mass when compared with
Through-Hole Soldering Information
conventional smt components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm. Oblong or oval nozzles
up to 11 x 9 mm may also be used within the space
available.
For further information please contact your local
Lineage Power Technical Sales Representative.
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Reflow Soldering Information
The surface mountable modules in the EQW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 48 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.
Surface Mount Information
Pick and Place
EQW Board
The SMT versions of the EQW series of DC-to-DC
power converters use an open-frame construction and
are designed for surface mount assembly within a
fully automated manufacturing process.
Insulator
The EQW-S series modules are fitted with a Kapton
label designed to provide a large flat surface for pick
and placing. The label is located covering the center
of gravity of the power module. The label meets all
the requirements for surface-mount processing, as
well as meeting UL safety agency standards. The
label will withstand reflow temperatures up to 300°C.
The label also carries product information such as
product code, date and location of manufacture.
Solder Ball
End assembly PCB
Figure 48. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn63/Pb37) solder for non-Z codes, or
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
Figure 47. Pick and Place Location.
Z plane Height
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
The ‘Z’ plane height of the pick and place label is 9.15
mm (0.360 in) nominal with an RSS tolerance of +/-
0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
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