Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
8
2.0 m/s
(400 LFM)
Thermal Considerations
(continued)
OUTPUT CURRENT, I
O
(A)
7
6
1.0 m/s
(200 LFM)
5
0.5 m/s
(100 LFM)
NC
AIRFLOW
Figure 13. T
ref
Temperature Measurement
Location for Open Frame Module.
4
3
20
30
40
50
60
70
o
80
90
AMBIENT TEMEPERATURE, T
A
( C
)
Figure 15. Output Current Derating for the Module
with Heatplate; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
AIRFLOW
OUTPUT CURRENT, I
O
(A)
8
7
Figure 14. T
ref
Temperature Measurement
Location for Module with Heatplate.
6
1.0 m/s
(200 LFM)
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
A
)
for natural convection and up to 3m/s (600 ft./min)
forced airflow are shown in Figure 14.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
8
5
0.5 m/s
(100 LFM)
NC
4
3
20
30
40
50
60
70
o
80
90
AMBIENT TEMEPERATURE, T
A
( C
)
Figure 16. Output Current Derating for the Module
with Heatplate and 0.25 in. heat sink; Airflow in
the Transverse Direction from Vout(+) to Vout(-);
Vin =48V.
8
OUTPUT CURRENT, I
O
(A)
1.0 m/s
(200 LFM)
7
OUTPUT CURRENT, I
O
(A)
3.0 m/s
(600 LFM)
6
0.5 m/s
(100 LFM)
7
6
5
NC
5
2.0 m/s
(400 LFM)
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
NC
4
4
3
20
30
40
50
60
70
o
80
90
3
AMBIENT TEMEPERATURE, T
A
( C
)
90
2
20
30
40
50
60
70
80
AMBIENT TEMEPERATURE, T
A
( C
)
o
Figure 14. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
Figure 17. Output Current Derating for the Module
with Heatplate and 0.5 in. heat sink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
LINEAGE
POWER
9