Data Sheet
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
June 29, 2009
process. It is recommended that the customer review
Thermal Considerations (continued)
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
8
7
6
0.5 m/s
(100 LFM)
NC
5
4
3
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
20
30
40
50
60
70
80
90
AMBIENT TEMEPERATURE, TA (oC)
Figure 18. Output Current Derating for the Module
with Heatplate and 1.0 in. heat sink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
Surface Mount Information
Pick and Place
300
The EHW007A0B modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
Peak Temp 235oC
250
Cooling
zone
1- 4 oCs-1
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Heat zone
max 4oCs-1
200
150
10 0
50
Soak zone
30-240s
T
lim above
205oC
Preheat zone
max4oCs-1
0
REFLOW TIME (S)
Figure 18. Reflow Profile for Tin/Lead (Sn/Pb)
process
240
235
230
225
220
215
210
205
200
Figure 17. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
0
10
20
30
40
50
60
Figure 19. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The EHW007A0B power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
LINEAGE POWER
10
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
