Data Sheet
EHHD006A0B Series Eighth-Brick Power Modules
18 - 75Vdc Input; 12V/6Adc Output
August 29, 2011
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is
AMBIENT TEMEPERATURE, TA (oC)
270C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Figure 18. Output Current Derating for the Module
with Heat plate; Airflow in the Transverse
Direction from Vout(-) to Vout(+);VIN =24V.
Please refer to the Application Note ‘Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules’ for a detailed discussion of
thermal aspects including maximum device
temperatures.
Surface Mount Information
Pick and Place
Heat Transfer via Conduction
The EHHD006A0B modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
The module can also be used in a sealed
environment with cooling via conduction from the
module’s top surface through a gap pad material to a
cold wall, as shown in Figure 19. This capability is
achieved by insuring the top side component skyline
profile achieves no more than 1mm height difference
between the tallest and the shortest power train part
that benefits from contact with the gap pad material.
The output current derating versus cold wall
temperature, when using a gap pad such as Bergquist
GP2500S20, is shown in Figure 20.
Figure 19. Cold Wall Mounting
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
COLDPLATE TEMEPERATURE, TC (oC)
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Figure 20. Derated Output Current versus Cold
Wall Temperature with Local Ambient
Temperature Around Module at 85C; VIN =24V or
48V.
Reflow Soldering Information
The surface mountable modules in the EHHD family
use our newest SMT technology called “Column Pin”
LINEAGE POWER
10
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
