欢迎访问ic37.com |
会员登录 免费注册
发布采购

AXH003A0X-SR 参数 Datasheet PDF下载

AXH003A0X-SR图片预览
型号: AXH003A0X-SR
PDF下载: 下载PDF文件 查看货源
内容描述: 2.4 - 5.5V直流输入; 0.75Vdc到3.63Vdc输出; 3A输出电流 [2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 3A output current]
分类和应用:
文件页数/大小: 20 页 / 703 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
 浏览型号AXH003A0X-SR的Datasheet PDF文件第12页浏览型号AXH003A0X-SR的Datasheet PDF文件第13页浏览型号AXH003A0X-SR的Datasheet PDF文件第14页浏览型号AXH003A0X-SR的Datasheet PDF文件第15页浏览型号AXH003A0X-SR的Datasheet PDF文件第16页浏览型号AXH003A0X-SR的Datasheet PDF文件第17页浏览型号AXH003A0X-SR的Datasheet PDF文件第18页浏览型号AXH003A0X-SR的Datasheet PDF文件第20页  
Data Sheet  
Austin MiniLynxTM SMT Non-isolated Power Modules:  
February 26, 2009  
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 3A output current  
required for MSL ratings of 2 or greater. These  
Surface Mount Information (continued)  
sealed packages should not be broken until time of  
use. Once the original package is broken, the floor  
life of the product at conditions of 30°C and 60%  
relative humidity varies according to the MSL rating  
(see J-STD-033A). The shelf life for dry packed SMT  
packages will be a minimum of 12 months from the  
bag seal date, when stored at the following conditions:  
< 40° C, < 90% relative humidity.  
Lead Free Soldering  
The –Z version Austin MiniLynx SMT modules are  
lead-free (Pb-free) and RoHS compliant and are both  
forward and backward compatible in a Pb-free and a  
SnPb soldering process. Failure to observe the  
instructions below may result in the failure of or cause  
damage to the modules and can adversely affect  
long-term reliability.  
Post Solder Cleaning and Drying  
Considerations  
Pb-free Reflow Profile  
Post solder cleaning is usually the final circuit-board  
assembly process prior to electrical board testing. The  
result of inadequate cleaning and drying can affect  
both the reliability of a power module and the  
testability of the finished circuit-board assembly. For  
guidance on appropriate soldering, cleaning and  
drying procedures, refer to Board Mounted Power  
Modules: Soldering and Cleaning Application Note  
(AN04-001).  
Power Systems will comply with J-STD-020 Rev. C  
(Moisture/Reflow Sensitivity Classification for  
Nonhermetic Solid State Surface Mount Devices) for  
both Pb-free solder profiles and MSL classification  
procedures. This standard provides a recommended  
forced-air-convection reflow profile based on the  
volume and thickness of the package (table 4-2). The  
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).  
The recommended linear reflow profile using  
Sn/Ag/Cu solder is shown in Figure. 39.  
300  
Per J-STD-020 Rev. C  
Peak Temp 260°C  
250  
MSL Rating  
Cooling  
The Austin MiniLynxTM SMT modules have a MSL  
rating of 1.  
200  
Zone  
* Min. Time Above 235°C  
15 Seconds  
150  
Heating Zone  
1°C/Second  
*Time Above 217°C  
60 Seconds  
Storage and Handling  
100  
50  
0
The Austin MiniLynxTM modules have a MSL rating of  
1. The recommended storage environment and  
handling procedures for moisture-sensitive surface  
mount packages is detailed in J-STD-033 Rev. A  
(Handling, Packing, Shipping and Use of  
Reflow Time (Seconds)  
Figure 39. Recommended linear reflow profile  
using Sn/Ag/Cu solder.  
Moisture/Reflow Sensitive Surface Mount Devices).  
Moisture barrier bags (MBB) with desiccant are  
LINEAGE POWER  
19  
 复制成功!