Data Sheet
Austin MiniLynxTM SMT Non-isolated Power Modules:
February 26, 2009
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 3A output current
Surface Mount Information
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Pick and Place
The Austin MiniLynxTM SMT modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and placing. The label meets all the
requirements for surface mount processing, as well as
safety standards and is able to withstand maximum
reflow temperature. The label also carries product
information such as product code, serial number and
location of manufacture.
300
Peak Temp 235oC
250
Cooling
zone
Heat zone
max 4oCs-1
200
150
10 0
50
1- 4 oCs-1
Soak zone
30-240s
T
lim above
205oC
Preheat zone
max 4oCs-1
0
REFLOW TIME (S)
Figure 37. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 36. Pick and Place Location.
Nozzle Recommendations
240
235
230
225
220
215
210
205
200
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
0
10
20
30
40
50
60
Figure 38. Time Limit Curve Above 205oC Reflow
for Tin Lead (Sn/Pb) process.
Tin Lead Soldering
The Austin MiniLynxTM SMT power modules are lead
free modules and can be soldered either in a lead-free
solder process or a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
The Austin MiniLynxTM SMT power modules are lead
free modules and can be soldered either in a lead-free
solder process or a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
LINEAGE POWER
18
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
