Data Sheet
Austin LynxTM II SMT Non-isolated Power Modules:
August 28, 2009
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 10A output current
300
Surface Mount Information (continued)
Per J-STD-020 Rev. C
Peak Temp 260°C
250
200
150
100
50
Lead Free Soldering
Cooling
Zone
The –Z version Austin Lynx II SMT modules are lead-
free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
* Min. Time Above 235°C
15 Seconds
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
0
Reflow Time (Seconds)
Pb-free Reflow Profile
Figure 38. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 38.
MSL Rating
The Austin Lynx II SMT modules have a MSL rating of
1
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of <= 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
LINEAGE POWER
20
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
