Data Sheet
Austin LynxTM II SMT Non-isolated Power Modules:
August 28, 2009
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 10A output current
Surface Mount Information
300
250
200
150
10 0
50
Pick and Place
Peak Temp 235oC
The Austin LynxTM II SMT modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and location of manufacture.
Cooling
zone
Heat zone
max 4oCs-1
1- 4 oCs-1
Soak zone
30-240s
T
lim above
205oC
Preheat zone
max 4oCs-1
0
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
REFLOW TIME (S)
Figure 36. Reflow Profile for Tin/Lead (Sn/Pb)
process.
240
235
230
225
220
215
210
205
200
Tin Lead Soldering
The Austin LynxTM II SMT power modules are lead
free modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
0
10
20
30
40
50
60
Figure 37. Time Limit Curve Above 205oC Reflow
for Tin Lead (Sn/Pb) process.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
LINEAGE POWER
19
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
