TYPICAL THERMAL CHARACTERISTICS
Measured at 25°C ambient. These parameters are not tested.
Typ
Parameter
Symbol
Parameter Description
PLCC
Units
θjc
Thermal impedance, junction to case
15
40
36
33
31
29
°C/W
θja
Thermal impedance, junction to ambient
°C/W
°C/W
°C/W
°C/W
°C/W
θjma
Thermal impedance, junction to
ambient with air flow
200 lfpm air
400 lfpm air
600 lfpm air
800 lfpm air
Plastic θjc Considerations
The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the
packagesurface. Testsindicatethismeasurementreferencepointisdirectlybelowthedie-attachareaonthebottomcenterofthe
package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
20
MACH215-12/15/20
LATTICE [ LATTICE SEMICONDUCTOR ]
