ML145050, ML145051
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
P DIP 20 = RP
(ML145050RP, ML145051RP)
CASE 738-03
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
0
B
1
C
L
INCHES
MIN MAX
1.070 25.66
MILLIMETERS
DIM
A
B
C
D
E
MIN
MAX
27.17
6.60
4.57
0.55
1.010
0.240
0.150
0.015
0.260
0.180
0.022
6.10
3.81
0.39
-T-
SEATING
PLANE
K
M
0.050 BSC
1.27 BSC
1.27
0.050
0.070
1.77
F
E
N
G
J
K
L
M
N
0.100 BSC
2.54 BSC
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
G
F
J 20 PL
0.300 BSC
7.62 BSC
0°
D 20 PL
M
M
0.25 (0.010)
T
B
0°
15°
15°
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T
A
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