SOLID TANTALUM CHIP CAPACITORS
TANTALUM MnO
2
COMPONENT PERFORMANCE CHARACTERISTICS
(con’t.)
35. Soldering
KEMET’s families of surface mount tantalum
capacitors are compatible with wave (single or
dual) soldering and IR or vapor phase reflow
techniques. Solder-coated terminations have
excellent wetting characteristics for high integrity
solder fillets. Preheating of these components is
recommended to avoid extreme thermal stress.
Figure 13 represents recommended maximum
solder temperature / time combinations for these
devices.
Note that although the X/7343-43 case size can
withstand wave soldering, the tall profile (4.3mm
maximum) dictates care in wave process devel-
opment.
Sn-Pb Profile
300
Temperature (°C)
250
200
150
During typical reflow operations a slight darken-
ing of the gold-colored epoxy may be observed.
This slight darkening is normal and is not harmful
to the product. Marking permanency is not affect-
ed by this change.
36. Washing
Standard washing techniques and solvents are
compatible with all KEMET surface mount tanta-
lum capacitors. Solvents such as Freon TMC and
TMS, Trichlorethane, methylene chloride, prelete,
and isopropyl alcohol are not harmful to these
components.
If ultrasonic agitation is utilized in the cleaning
process, care should be taken to minimize ener-
gy levels and exposure times to avoid damage to
the terminations.
KEMET tantalum chips are also compatible with
newer aqueous and semi-aqueous processes.
Please follow the recommendations for cleaning
as defined by the solder vendor.
37. Encapsulations
Under normal circumstances, potting or encap-
sulation of KEMET tantalum chips is not required.
38. Storage Environment
Tantalum chip capacitors should be stored in
normal working environments. While the chips
themselves are quite robust in other environ-
ments, solderability will be degraded by expo-
sure to high temperatures, high humidity, corro-
sive atmospheres, and long term storage. In
addition, packaging materials will be degraded
by high temperature – reels may soften or warp,
and tape peel force may increase. KEMET rec-
ommends that maximum storage temperature
not exceed 40 degrees C, and maximum storage
humidity not exceed 60% relative humidity. In
addition, temperature fluctuations should be
minimized to avoid condensation on the parts,
and atmospheres should be free of chlorine and
sulfur bearing compounds. For optimized solder-
ability, chip stock should be used promptly,
preferably within 3 years of receipt.
39. Component Weights
•
T49x, T510 Series
Series
T49x
T49x
T49x
T49x
T49x
T49x
T49x
T49x
T49x
T49x
T49x
T510
T510
T510
5 Sec.
45 Sec.
100
45 Sec.
90 Sec.
50
0
0
50
100
150
Time (Seconds)
95 Sec.
200
250
300
60 Sec.
Pb-Free Profile
260˚C Peak Temperature (3 passes)
FIGURE 13
Time/Temperature Soldering Profile
Hand-soldering should be performed with care
due to the difficulty in process control. If per-
formed, care should be taken to avoid contact of
the soldering iron to the molded case. The iron
should be used to heat the solder pad, applying
solder between the pad and the termination, until
reflow occurs. The iron should be removed.
“Wiping” the edges of a chip and heating the top
surface is not recommended.
Case Size
A/3216-18
B/3528-21
C/6032-28
D/7343-31
X/7343-43
E/7360-38
R/2012-12
S/3216-12
T/3528-12
U/6032-15
V/7343-20
D/7343-31
X/7343-43
E/7360-38
Typical Weight
(mg)
32
60
130
320
500
600
10
21
34
70
206
338
510
645
14
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KEMET [ KEMET CORPORATION ]
