SOLID TANTALUM CHIP CAPACITORS
TANTALUM MnO
2
COMPONENT PERFORMANCE CHARACTERISTICS
(con’t.)
• Tensile Force
•
Four Pounds (1.8 kilograms), 60 Seconds
and Pb-Free soldering processes.
90Sn/10Pb terminations are also available and
can be ordered with an "H" suffix.
KEMET's "S" suffix remains an active termination
designator for current designs but is not recom-
mended for new designs. Parts ordered with an
"S" suffix are not guaranteed to be Pb-Free or
RoHS compliant. Refer to www.kemet.com for
information on Pb-Free transition.
For conductive adhesive attachment processes, a
gold termination finish is available for most series and
case sizes. Refer to the specific series for details.
34. Recommended Mounting Pad Geometries
Proper mounting pad geometries are essential
for successful solder connections. These dimen-
sions are highly process sensitive and should be
designed to maximize the integrity of the solder
joint, and to minimize component rework due to
unacceptable solder joints.
Figure 12 illustrates pad geometry. Tables 9 &
10 provide recommended pad dimensions for
both wave and reflow soldering techniques.
These dimensions are intended to be a starting
point for circuit board designers, to
be fine tuned, if necessary, based upon the pecu-
liarities of the soldering process and/or circuit
board design.
Contact KEMET for Engineering Bulletin Number
F-2100 entitled “Surface Mount Mounting Pad
Dimensions and Considerations” for further
details on this subject.
C
Solid Tantalum Surface Mount
4 lb. (1.8 Kg)
• Shear Force
Table 8 Maximum Shear Loads
Case Code
KEMET
EIA
R
2012-12
S
3216-12
T
3528-12
U
6032-15
V
7343-20
A
3216-18
B
3528-21
C
6032-28
D
7343-31
X
7343-43
E
7260-38
Maximum Shear Loads
Kilograms
Pounds
2.4
5.3
3.2
7.0
3.6
8.0
4.5
10.0
5.0
11.0
3.2
7.0
3.6
8.0
4.5
10.0
5.0
11.0
5.0
11.0
5.0
11.0
Post Test Performance:
a. Capacitance — within ±5% of initial value
b. DC Leakage — within initial limit
c. Dissipation Factor — within initial limit
X
G
Z
Figure 12
Grid
Placement
Courtyard
Y
APPLICATIONS
32. Handling
Automatic handling of encapsulated components
is enhanced by the molded case which provides
compatibility with all types of high speed pick and
place equipment. Manual handling of these
devices presents no unique problems. Care
should be taken with your fingers, however, to
avoid touching the solder-coated terminations as
body oils, acids and salts will degrade the sol-
derability of these terminations. Finger cots
should be used whenever manually handling all
solderable surfaces.
Table 9 – Land Pattern Dimensions for Reflow Solder
KEMET/EIA Size Code
R/2012-12
A/3216-18, S/3216-12
B/3528-21, T/3528-12
C/6032-28, U/6032-15
D/7343-31, V/7343-20, X/7343-43
E/7260-38
Pad Dimensions - mm
Y
C
Z
G
X
(ref) (ref)
3.90
4.70
5.00
7.60
8.90
8.90
0.80
0.80
1.10
2.50
3.80
3.80
1.80
1.50
2.50
2.50
2.70
4.40
1.55
1.95
1.95
2.55
2.55
2.55
2.35
2.75
3.05
5.05
6.35
6.35
33. Termination Coating
Table 10 – Land Pattern Dimensions for Wave Solder
KEMET's standard termination finish is 100% Sn
Pad Dimensions - mm
(Excluding the T492/3 series. Refer to specific
Y
C
KEMET/EIA Size Code
Z
G
X
(ref) (ref)
lead frame options available on T493 Series).
4.30 0.80 1.26 1.75 2.55
R/2012-12
Standard terminations can be ordered with a "T"
5.10 0.80 1.10 2.15 2.95
A/3216-18, S/3216-12
suffix in the lead material designator of the
5.40 1.10 1.80 2.15 3.25
B/3528-21, T/3528-12
KEMET part number. Components ordered with
8.00 2.50 1.80 2.75 5.25
C/6032-28, U/6032-15
the "T" suffix are Pb-Free/RoHS compliant and
D/7343-31, V/7343-20, X/7343-43 9.70 3.80 2.70 2.95 6.75
E/7260-38
9.70 3.80 4.40 2.95 6.75
are backward and forward compatible with SnPb
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
13
KEMET [ KEMET CORPORATION ]
