Metallized Polypropylene Film EMI Suppression Capacitors
R47 Series, Class X1, 440 VAC, 110ºC (Automotive Grade)
Lead Taping & Packaging (IEC 60286–2)
Figure 1
Figure 2
Figure 3
Lead Spacing 10 mm
Lead Spacing 15 mm
Lead Spacing 22.5 – 27.5 mm
P
P
h
h
P2
ød
P1 P0
F
D0
t
P1
P2
Taping Specification
Dimensions (mm)
Lead Space
Description
Symbol
10
Fig. 1
0.6
15
22.5
Fig. 3
0.8
27.5
Fig. 3
0.8
Tol.
Fig. 2
0.6-0.8
25.4
12.7
5.2
Lead wire diameter
Taping lead space
d
P
±0.05
±1
25.4
12.7
7.7
38.1
12.7
7.8
38.1
12.7
5.3
Feedꢀholeꢀleadꢀspaceꢀ*
Centering of the lead wire
Centering of the body
Leadꢀspacingꢀ(pitch)ꢀ***
Component alignment
P0
P1
P2
F
±0.2ꢀ**
±0.7
12.7
10
12.7
15
19.05
22.5
0
19.05
27.5
0
±1.3
+0.6/-0.1
±2
∆h
0
0
Height of component
from tape center
H0ꢀ****
18.5
18.5
18.5
18.5
±0.5
Carrier tape width
Hold down tape width
Hole position
W
W0
W1
W2
D0
t
18
9
18
10
9
18
10
9
18
10
9
+1ꢀ/ꢀ-0.5
Minimum
±0.5
9
Hold down tape position
Feed hole diameter
Tape thickness
3
3
3
3
Maximum
±0.2
4
4
4
4
0.7
0.7
0.7
0.7
±0.2
* Also available in 15 mm.
** Max 1 mm on 20 lead spaces.
*** Pitches 15 mm and 10 mm taped to 7.5 mm (crimped leads) available upon request.
**** H0 = 16.5 mm available upon request.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F3097_R47_X1_440 • 6/9/2016 14
KEMET [ KEMET CORPORATION ]
