King Billion Electronics Co., Ltd.
HE89C21
駿 億 電 子 股 份 有 限 公 司
HE80000 SERIES
18. Application Circuit
VDD
0.1uF
47uF
+
3.0V
C11
33p
C12
33p
Y3
32768Hz
3579545Hz
VDD
22p
22p
0
51K
PRTC5
PRTC4
PRTC3
PRTC2
PRTC1
PRTC0
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
1
2
52
PRTC5
TSTP
FXI
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
FXI
PRTC4
PRTC3
PRTC2
PRTC1
PRTC0
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
3
FXO
FXO
4
RESET
RSTP
GND
LV3
5
6
LV3
0.1uF
7
LV2
LV2
8
LV1
LV1
9
LC2
104
LC2
0.47uF
HE89C21
10
11
12
13
14
15
16
17
LC1
LC1
COM0
COM1
COM2
COM3
SEG0
SEG1
SEG2
COM0
COM1
COM2
COM3
SEG0
SEG1
SEG2
0.1uF
0.1uF
19. Important Note
1. Please bond the TSTP_P, RSTP_N and PRTD[7:0] with test points on PCB, which can be soldered
and probed, and connect TSTP_P pin with zero ohm resistor to GND (or copper wire which can be cut
easily on PCB) for good ESD protection. So that IC testing can be done on PCB, if necessary by
removing the 0-ohm resistor and driving TSTP_P pin to high.LV3 must small than 9.0 Volt. Otherwise
IC may breakdown.
20. Updated Record
Version
Date Section
Original Content
New Content
January 20, 2003
16
V1.0E
KB [ King blillion Electronics Co.,Ltd. ]
