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LCC110 参数 Datasheet PDF下载

LCC110图片预览
型号: LCC110
PDF下载: 下载PDF文件 查看货源
内容描述: 1 - C型继电器OptoMOS [1-Form-C OptoMOS Relay]
分类和应用: 继电器
文件页数/大小: 9 页 / 148 K
品牌: IXYS [ IXYS CORPORATION ]
 浏览型号LCC110的Datasheet PDF文件第1页浏览型号LCC110的Datasheet PDF文件第2页浏览型号LCC110的Datasheet PDF文件第3页浏览型号LCC110的Datasheet PDF文件第4页浏览型号LCC110的Datasheet PDF文件第5页浏览型号LCC110的Datasheet PDF文件第6页浏览型号LCC110的Datasheet PDF文件第8页浏览型号LCC110的Datasheet PDF文件第9页  
LCC110  
INTEGRATED  
CIRCUITS  
DIVISION  
Manufacturing Information  
Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to  
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according  
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
LCC110 / LCC110S / LCC110P  
MSL 1  
ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020  
must be observed.  
Device  
MaximumTemperature xTime  
LCC110 / LCC110S  
LCC110P  
250ºC for 30 seconds  
260ºC for 30 seconds  
Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as  
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary  
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.  
Cleaning methods that employ ultrasonic energy should not be used.  
Pb  
e3  
R06  
www.ixysic.com  
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