ZIF Connectors
Contacts
Contacts
he Cannon DL Crimp and Buss contacts
are available in addition to the factory
installed Square Post/PCB mount version
contacts. Crimp contacts are available loose or
reeled, where as Buss contacts are available loose
only.
T
The Buss contacts make the DL series capable of
providing higher than 5 amps per line. The Buss
contacts are pairs of contact lines which increase
the amperage capability in increments of10 amps
up to 60 amps. The contacts have solder holes at
the tail section for soldering #30-#18 AWG. The
tail is also designed to accommodate a1/8⍯ crimp
lug for wire sizes larger than #18.
The Crimp contacts are available in two plating
types. The 20µ inch gold hermaphroditic version
which is the economical choice for applications
requiring over 100 milliamps to 5 amps. And the
50µ inch gold BUMP to FLAT version which offers
the most versatile range of application
requirements from micro-amps to 5 amps.
The BUMP to FLAT version was developed
specifically to handle ‘‘dry circuit’’ requirements
where the signal amperage is not enough to
ensure a clean contact point. The 50µ inch gold
BUMP to FLAT version is mandatory for
applications with signals below 100 milliamps.
The Bump contact is installed in the Plug and the ensures that the wiping point becomes the current for all modern applications where power and low
Flat contact is installed in the Receptacle. This carrying point after mating. The 50µ inch gold voltage signals are combined into one connector.
combination increases the contact force and BUMP to FLAT version has become the standard
Materials and Finishes
Description
Material
Finish
Crimp Contact*
Buss Contact
Copper Alloy
Copper Alloy
Gold over nickel or Selective gold/tin lead over nickel
Gold over nickel
*Order crimp contacts separately. See pages 52-53.
Dimensions are shown in mm (inch)
Dimensions subject to change
50
ITT [ ITT Cannon ]
