®
PACKAGING INFORMATION
Mini Ball Grid Array
ISSI
Package Code: B (48-pin)
Top View
Bottom View
φ b (48x)
1
2
3
4
5 6
6
5
4
3
2
1
A
B
C
D
E
F
A
B
C
D
E
F
e
D
D1
G
H
G
H
e
E
E1
Notes:
1. Controllingdimensionsareinmillimeters.
A2
A
A1
SEATING PLANE
mBGA - 6mm x 8mm
mBGA - 8mm x 10mm
MILLIMETERS
INCHES
MILLIMETER
INCHES
Sym. Min. Typ. Max.
Min. Typ. Max.
Sym. Min. Typ. Max.
Min. Typ. Max.
N0.
N0.
Leads
48
Leads
48
A
—
—
—
—
—
1.20
0.30
—
—
—
—
—
—
0.047
0.012
—
A
—
—
—
—
—
1.20
0.30
—
—
—
—
—
—
0.047
0.012
—
A1
A2
D
0.24
0.60
7.90
0.009
0.024
0.311
A1
A2
D
0.24
0.60
9.90
0.009
0.024
0.390
8.10
0.319
10.10
0.398
D1
E
5.25 BSC
—
0.207 BSC
D1
E
5.25 BSC
—
0.207 BSC
5.90
6.10
0.232
—
0.240
7.90
8.10
0.311
—
0.319
E1
e
3.75 BSC
0.75 BSC
0.148 BSC
E1
e
3.75 BSC
0.75 BSC
0.148 BSC
0.030 BSC
0.030 BSC
b
0.30 0.35 0.40
0.012 0.014 0.016
b
0.30 0.35 0.40
0.012 0.014 0.016
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. D
01/15/03
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
